• Wuxi Qianye Micro Nano Technology Co., Ltd

    19 years of research and development of semiconductor power devices
            Specializing in power semiconductor device research and development for nearly 20 years, with an industry experienced R & D team, the company has been committed to the development and application of semiconductor power devices since its establishment, the products are widely used in various consumer markets. Cooperate with world class fabs to lay a solid foundation for high quality products. In 2018, the superjunction FET made breakthrough progress and reached the advanced level of the industry, becoming one of the leading semiconductor power device manufacturers in China. The company has advanced layout in the field of IGBT and silicon carbide, and has applied for many authorized patents. In 2020, its own packaging form TDHD came out, removing the packaging inductance, packaging internal resistance, packaging thermal resistance switch speed greatly improved, MOS itself heating greatly reduced, heat dissipation greatly increased. In 2021, a 100,000-level dust-free workshop will be established to achieve mass production of TDHD and WLCSP packaging.
            The company is headquartered in Wuxi City, Jiangsu Province, and has branches and offices in Hong Kong, Huizhou, Shenzhen and Shanghai. Committed to building the company into a domestic first-class, the world's advanced semiconductor power device factory.
     
    企业文化/company culture

    Take technology as the root

    Humanized management

    Be market oriented

    In the existing technical field of continuous improvement, breakthrough innovation, to create competitive products
    It aims to provide a platform for employees to play their own advantages
    Grasp the pulse of The Times
    Be the market leader
  • 2003 2005 2006 2011 2018 2019 2021
    • 2003

      Established Qianye Electronics in Huizhou, Guangdong Province

    • 2005

      Negotiated chip cooperation with TSMC and successfully mass-produced low voltage power MOS

      at TSMC by the end of the year

    • 2006

      Mass production of medium and low voltage MOS

    • 2011

      Establishing MCU R&D studio in Shanghai

    • 2018

      650V super junction MOSFET has made breakthrough progress and reached the industry's advanced level;

      The main platform of a single potassium protection IC has been successfully constructed,

      and two ICs can be mass-produced.

    • 2019

      Establishing a research and development center in Wuxi, Jiangsu Province

    • 2021

      Obtained the Jiangsu Province Gazelle Plan to cultivate enterprises

      Self packaging form and WLCSP achieve independent mass production

  • 100610-HWIque
    100610-NruFBB
    100610-zYlMdv
    100610-LuBrSZ
    100610-rSEJMB
    100610-lnqmPc
    100610-NruFBB
    100610-swnUoR
    • 100610-skugoH
      100610-vPHfXq
      100610-rAwlyz
      100610-JnApcK
      100610-JMLVJK
      100610-MTpVDa
      100610-SHIEvb
      100610-GerogQ